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BGA Socket Adapter for 272 pin, 1.27mm pitch BGA Socketing
September 27, 2013
The LS-BGA272A-05 allows socketing on any board by just soldering the SF-BGA272A-B-32 female adapter to the target PCB with BGA lands using standard reflow methods. The LS-BGA272A-05 is plugged into female adapter. The user can then attach a standard BGA socket just as if the holes for the socket were on the board.User can install chip in the BGA socket such as the 8 GHz bandwidth Ironwood Electronics SG-BGA-6010 and begin testing. Send a comment
Socket for 42.5x42.5mm, 41x41, 1mm pitch with heat sink compression screw , 10 GHz
September 27, 2013
The SG-BGA-8038 is a socket for IC's with 42.5X42.5mm body, 1 mm pitch, 41X41 array with up to 1681 pins. The socket is supplied with heatsink and fan with dissipation capacity for up to 50 Watts. Socket body is attached to target PCB with 8 compressions to bak plate and insulation plate. The fan and top adapter are mounted to the heatsink screw. The chip is installed in the socket and lid/compression plate are installed and the compression screw tightened with proper force. The chip and socket are ready to operate at 10 GHz bandwidth. Send a comment
GHz Bandwidth QFN Socket with Very High Power Dissipation
September 25, 2013
The CBT-QFN-7030 offers over 15 GHz Bandwidth and up to 10 watts of power dissipation through a ground pad connection method via gold plated copper block. The contactors are stamped spring pins, gold plated with over 2 AMPs per pin capacity. The ground pad is connected to the test board via a copper block that is gold plated such that it has very high bandwidth and very good thermal conductivity to the ground pad on the target PCB. User simply inserts chip and turns the compression screw until tight for thousands of cycles to hand test a large number of chips. Send a comment
BGA adapter with 580 pins allows testing and upgrading for 580 pin BGA chip
September 13, 2013
The SF-BGA580C-B-42 is a 1 mm pitch BGA emulation adapter which allows interconnection to (26X26 array) 580 pin BGA pads on the target board. The SF-BGA580C-B-42 has 580 female pins into which matching male pins can be inserted for connection. The SF-BGA580C-B-42 is soldered to the same pads the chip is soldered to and with the same reflow profile. After the SF-BGA580C-B-42 is soldered the user can plug a matching pattern male adapter (pins) into the female SF-BGA580C-B-42 allowing interconnection for test and upgrading of the target board. Send a comment
DDR Module with 8 sockets, no holes
September 12, 2013
An existing off the shelf DDR RAM board with 9 positions has all positions socketed. User can then easily test numerous chips in actual application of DDR Module. The DDR chips are removed (or never installed), then sockets are mounted using Ironwood Electronics epoxy mount GHz socket technology. The chips are installed in the Ironwood Electronics 8 GHz elastomer sockets and testing begins. Many more chips can be tested in situ on the DDR module by simply removing tested parts and inserting the untest. Send a comment
SMT socket system for 1440 pin, 1mm pitch BGA
August 19, 2013
This socket is a surface mountable GHz BGA socket system for 1440 pin 1mm pitch 42mm x46.46mm x 5.265mm ceramic BGA using compatible SMT adapter. The SMT adapter is soldered to the BGA pads on the target board using standard BGA solder reflow methods for RoHS solder profiles. The socket is then attached to the SMT adapter with 16 screws. This adapter can be mounted on any PCB without mounting holes as long as there is no component interference. The socket performance results in over 3 GHz bandwidth. Send a comment
High Volume Adapter Upgrades Older QFP128 to Latest Technology
August 8, 2013
This adapter upgrades QFP 128, 0.8mm pitch with a QFP176 position surface mount chip along with other components. The net list can be customized to any configuration. The Actel A42MX16 or any Actel 40MX or 42MX devices in QFP176 package can be used on the adapter to upgrade the target QFP128. This adapter is designed for volume applications where pick and place is used to pull the adapter from trays and place onto target board. The entire target board is reflowed with other components on the target board. The target board has land pattern for QFP128 at 0.8 pitch. The adapter is soldered to the target board using solder columns approximately 0.25mm high. The device will solder with similar profile as used on a standard QFP. Send a comment
Surface Mount Package Emulator for 144 pin QFP, 0.5 pitch
August 7, 2013
This surface mount package emulator is a female MGA version of SF-QFE144SC-G-01. It is constructed for mounting the same as a chip with gull-wing leads. Plugs with 144 pin Ironwood MGA male interface. There is a Pin 1 corner chamfer mark on the silkscreen. To easily attach to the target board, reflow only once per Gull-wing soldering instructions – GSI.pdf.. the operating Temperature range is -35C - +140C. The number of insertions is up to 100 with compatible Ironwood MGA male interface. The mating insertion extraction force Mating insertion force with compatible male part (0.45mm tail) is 4.6kg -0.0kg +1.0kg. The mating extraction force with compatible male part (0.45mm tail) is 2.9kg -0.0kg +0.7kg. The mapping is the same as Ironwood Electronics SF-QFE144SC-G-01 from top view. Simply solder this surface mount package emulator adapter to your pads for QFP144, 0.5 pitch and then plug probing, package conversion, and test adapters, connecting to the pads. Send a comment
Easily test dual row 116 pin QFN
July 19, 2013
Test a dual row QFN IC with 116 pins and power pad at 15.7GHz? Answer is CBT-QFN-7022 with drawing here. http://ironwoodelectronics.com/catalog/Content/Drawings/CBT-QFN-7022Dwg.PDF. All 116 pins of QFN116 are contacted with 15.7GHz bandwidth stamped spring pins. The power pad in center is connected to the target PCB with 25 more of the same high frequency spring pins. Further electrical characteristics of the interconnect include 4 amp per pin capacity, 0.88 nH self inductance, 0.097 pF of capacitance, and a contact resistance of <35 milliohms. To use the socket, it is mounted on the specifically configured PC board with requisite mounting holes for screws and guide pins. The socket itself can dissipate up to 4 watts with no added heat sinking. More if fan is provided. The socket is compatible with Amkor QFN (MLF)packages of dual row and 116 pins . The socket is both easy to install and to use. Simply attach to the board with 4 screws and begin inserting chips. Chips can be inserted and removed with simple insertion and twist of compression screw – a few seconds. Applications include testing for prototype evaluation, hand test parts, and chip burn-in test. Send a comment
BGA socket for 64MB NAND flash memory
April 3, 2013
The requirement is for a standard BGA socket for 64MB NAND flash memory. It is a 0.8mm pitch, 9x11mm IC size, 10x12 array BGA63 memory devices. We developed many BGA sockets for 11x11mm IC. We proposed a custom solution which involved in producing one new component. The new component was precisely machined IC guide which reduces IC pocket opening from 11x11mm to 9x11mm. We manufactured and delivered the custom BGA socket on a fast turn. Since we have hundreds of standard BGA sockets, our custom solution involves simple modification of the standard BGA socket to meet customer’s requirements. This particular GHz BGA socket operates at bandwidths up to 8 GHz with less than 1dB of insertion loss sufficient enough to accommodate 64MB NAND flash memory. The contact resistance is typically 20 milliohms per pin. The BGA socket connects all pins with 8 GHz bandwidth on all connections. The BGA socket is mounted on the target PCB with no soldering, and uses industry’s smallest footprint (only 2.5mm more on each side). The BGA socket is constructed with shoulder screw and swivel lid which incorporates a quick insertion method so that IC’s can be changed out quickly. Send a comment
Stamped spring pin BGA socket with clamshell lid for 0.8mm pitch BGA361
March 20, 2013
This requirement is for a BGA socket for BGA361, 16x16mm, 0.8mm pitch. We had a standard BGA socket readily available. Customer asked for modification to the stiffener that interfaces to the back side of the target PCB. The electrical design requirement dictates passive components to be placed directly behind the BGA device footprint. We made a custom plastic part that has cutouts as per target board design and placed between customer PCB and stiffener. BGA socket top interface is our standard clamshell which provides quick insertion and removal of BGA devices. Since most of our custom solutions are simple modification of standard BGA sockets, we can accommodate customer’s quick turn project schedule. The contactor is a stamped spring pin with 31 gram actuation force per pin and cycle life of 500,000 insertions. The self inductance of the contactor is 0.88 nH, insertion loss of < 1 dB at 15.7 GHz and capacitance 0.097pF. The current capacity of each contactor is 4 amps. Socket temperature range is -55C to +180C. Send a comment
BGA socket for DDR2 SDRAM
December 12, 2012
The requirement is for a standard BGA socket for DDR2 SDRAM. It is a 0.8mm pitch, 8x10mm IC size, 9x11 array BGA60 memory devices. We have developed many BGA sockets for 8x10mm IC. This memory device had a rectangular projection on the bottom side. A custom solution was proposed which involved in making one new component. The new component was laser cut ball guide which positioned BGA device balls to PCB pads accurately with a rectangular cutout for the projection on the bottom side. Custom BGA socket was manufactured and delivered on a fast turn. This particular GHz BGA socket operates at bandwidths up to 8 GHz with less than 1dB of insertion loss sufficient enough to accommodate DDR2 SDRAM. The contact resistance is typically 20 milliohms per pin. The BGA socket connects all pins with 8 GHz bandwidth on all connections. The BGA socket is mounted on the target PCB with no soldering, and uses industry’s smallest footprint (only 2.5mm more on each side). The BGA socket is constructed with shoulder screw and swivel lid which incorporates a quick insertion method so that IC’s can be changed out quickly. Send a comment
 
 
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