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Selected part:   SG-BGA-6014   Note: 13% discount on orders of 11 or more.          For high volume orders, you may request           a quote by selecting the button below.  Price:        Note: Taxes and Shipping Increase Costs for Non-USA Customers. Contact Your Local Distributor.      Minimum Quantity:              Drawings & Maps ==> Manual: SGB.pdf Photo: SG-BGA_35_mm_Body.jpg DXF Layout: SG-BGA-6014_Layout.dxf Drawing: SG-BGA-6014dwg.PDF Recommended Tool: Tl-Torquedriver-03dwg.pdf

Search by Part Number         PART NUMBER   ROHS    BACKING PLATE    CAVITY DOWN    HEAT SINK    IC ARRAY X    IC ARRAY Y    IC BALL COPLANARITY MM    IC BALL DIAMETER MAX MM    IC BALL HEIGHT MAX MM    IC BALL HEIGHT MIN MM    IC SIZE TOLERANCE MM    IC SIZE X MM    IC SIZE Y MM    IC TOP SURFACE    IC TOTAL HEIGHT MAX MM    MAX PACKAGE CODE    MAX PINCOUNT    MIN ORDER QTY    PART DESCRIPTION    SOCKET LID    TOP PITCH   SG-BGA-6014   yes   yes   no   no   27   27   0.2   0.9   0.7   0.5   0.2   35   35   Flat   2.5   BGA729A   729   0   GHz BGA Socket (ZIF)   ZIF (screw)   1.27

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