Diamond Particle Sockets

40 GHz Sockets

These new technologies allow very high frequency response and very wide temperature range sockets. Exatron diamond particle is particularly effective for QFN with very low series resistance but requires tight coplanarity. Xtreme GHz Elastomer is applicable to socketing most SMT IC technologies.
 
These socket technologies allow socketing of IC's with high frequency bandwidth to 40 GHz, temperature range to 200oC, and high number of insertions. The tables below show the sockets that are available immediately. In addition custom sockets using these technologies can be in your hands in a matter of weeks. A general description of the technologies follow the table and detailed descriptions are found in the Technical Documents below.
 
Socket Tables
Diamond Particle Sockets

The Exatron diamond particle interconnect is an ideal medium for very high frequency QFN applications up to 40 GHz. Typical specifications for the interconnect include:
  • Contact resistance under 3 milliOHMS
  • Inductance and Capacitance approaches zero
  • 40 GHz bandwidth
  • 10-12 grams per contact
  • -70 to 200oC
  • 100,000 insertions
  • Pitch down to 0.4mm
The contactor consists of diamond particles embedded into the circuitry on a Kapton or Teflon PCB. The diamond particles along with the circuitry are plated with nickel and over that with gold.



Xtreme GHz Sockets Featuring Silver Filled Elastomer With Spike Caps - BGA, LGA.

Ironwood Electronics has released new GHz BGA and LGA sockets for high temperature, high current, and high frequency applications. The socket uses high temperature conductive elastomer. The sockets deliver the clearest possible signal due to the extremely short current path, low resistance, and ultra-low inductance and capacitance. The socket comes with overcompression stop. Typical specifications for the interconnect include:
  • 40 GHz Bandwidth
  • 0.11 nH Self Inductance
  • 0.015 nH Mutual Inductance
  • 0.028 pF Mutual Capacitance
  • Less than 50 mOhms Contact Resistance
  • -40 C to 155 C
  • 5 Amps per pin
  • 15-25 grams per pin
The interconnect consists of gold/nickel plated copper pads with spiked caps that makes contact with package leads. The interconnect can be cleaned in minutes. Below is a cross section of one contact in an Xtreme GHz socket array.


 
Technical Documents
  • Extreme GHz Elastomer Socket
  • Diamond Particle Interconnect Specification
  • Ironwood GHz BGA Sockets
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