Surface mount Land Sockets (or Chip Carriers) are a cost effective and highly reliable alternative to ZIF sockets. Our land sockets provide a top interface of SMT lands (BGA or QFP) for mounting your device, while the bottom interface presents a through-hole pin configuration. Land sockets can be used with our SMT emulation bases, or other parts, to achieve a plug-able connection for SMT packages.

Eliminating problems with soldering to high mass pins, the surface mount lands of our chip carriers are thermally and mechanically isolated.

BGA land sockets are typically paired with one of our female SMT emulator bases (-02 version), which would be mounted on a target board. BGA land sockets may also be plugged into one of our compatible MGA (.050" pin grid array) or uGA(1mm pin grid array) connections, found in many other Ironwood parts such as probe boards.

QFP land sockets are designed to fit into specific through-hole layouts for AMP, Textool, or industry standard ZIF sockets. We have also designed socket receptacles to provide a plug-able connection for our land sockets, and production or ZIF sockets.