EAGAN, MN. – April, 2004 – Ironwood Electronics’ new high performance Socket – SG-BGA-6103 allow 0.8 mm pitch JEDEC MO-207 IC’s to be used in socket and operate without compromising performance in very high speed computing and communication applications. The new 6.5 GHz bandwidth sockets easily support very dense BGA stacked devices utilizing a high performance conductive elastomer contactor. The contact resistance is normally 10 milliohms. The sockets have a precision design, which guides the IC to the exact position for connection of each ball and uses an aluminum heat sink screw to provide compressive force. The socket shown in the picture is SG-BGA-6103 for 21X12.5 mm IC body size. The socket accommodates IC packages such as the JEDEC MO-207 BGA, 0.8 mm pitch, and 21X9 arrays with up to 189 balls.

These patented ZIF sockets are simply mechanically mounted to the target PCB. The sockets are 7.5 mm high and only slightly larger than the actual IC packages, minimizing footprint on system boards while maximizing system speeds. The socket is designed to dissipate up to 5 watts.

Call for pricing information.


Ila Pal
11351 Rupp Dr.
Suite 400
Burnsville, MN 55337


Tel: 952-229-8200 or (800) 404 – 0204
Fax: 952-229–8201
info@ironwoodelectronics.com
www.ironwoodelectronics.com