Users can socket their high-density Xilinx FF1704 without performance loss.

EAGAN, MN. – July 2003 – Ironwood Electronics’ new SG-BGA-6082 allows users to socket the Xilinx Multi-Million gate FPGA’s and operate without compromising performance. The new GHz bandwidth socket easily support the 42.5 mm body, 1 mm pitch Xilinx FF1704 packaged devices utilizing a high performance conductive elastomer contactor. The contact resistance is normally 10 milliohms. The sockets have a precision ball-guide design, which moves the IC to the exact position for connection of each of the 1704 balls and uses an aluminum heatsink screw to provide compressive force. These patented ZIF sockets and simply mechanically mounted to the target PCB. The socket lid is twisted open, the IC is inserted, the lid is closed, and the aluminum heatsink screw is rotated to provide downward force on the IC. The sockets are 7.5 mm high and only 2.5 mm per side larger than the 42.5 mm package body, minizing footpring on the target board while maximizing system speeds. The socket body and heatsink screw are constructed with aluminum to facilitate heat-sinking. Optional cutouts for backside capacitors can be easily implemented.


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Ila Pal
11351 Rupp Dr.
Suite 400
Burnsville, MN 55337


Tel: 952-229-8200 or (800) 404 – 0204
Fax: 952-229–8201
info@ironwoodelectronics.com
www.ironwoodelectronics.com