Users can socket their 1.0 mm pitch, 40 mm body BGA devices with power dissipation up to 30 watts

EAGAN, MN. – March, 2003 – Ironwood Electronics’ new high performance solderless SG-BGA-6080 Socket allows 30 watt BGA IC’s to be socketed and operate without compromising performance in very high speed communication or computing applications. The new 6.5 GHz bandwidth sockets easily support very dense BGA devices utilizing a high performance conductive elastomer contactor. The socket is a precision device, which guides the IC to the exact position for connection of each ball and uses an aluminum heat sink to provide compressive force. The socket shown in the picture is a 40 mm body size SG-BGA-6080. The SG-BGA-6080 accommodates IC packages with 1.0 mm pitch, 39X39 array. A typical IC package is a Layer N Network ASICBGA993. An integral aluminum finned heatsink is designed to dissipate up to 30 watts. A top down fan can be mounted on the heatsink.

These patent pending ZIF sockets are simply mechanically mounted to the target PCB. A backing plate on the opposite of the board is required to maintain connection stability. An insulator plate that allows spacing for backside capacitors and other components can be easily customized for any configuration.

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11351 Rupp Dr.
Suite 400
Burnsville, MN 55337


Tel: 952-229-8200 or (800) 404 – 0204
Fax: 952-229–8201
info@ironwoodelectronics.com
www.ironwoodelectronics.com