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Users can socket their 0.5 mm pitch BGA/CSP devices without performance loss.

EAGAN, MN. – June, 2002 – Ironwood Electronics’ new high performance Sockets allow 0.5 mm pitch BGA/CSP IC’s to be socketed and operate without compromising performance in very high speed communication or computing applications. The new 10 GHz bandwidth sockets easily support very dense BGA devices utilizing a high performance conductive elastomer contactor. The socket is a precision device, which guides the IC to the exact position for connection of each ball and uses an aluminum heat sink screw to provide compressive force. The socket shown in the picture is an 8 mm body size SG-BGA-7000. The SG-BGA-7000 accommodates IC packages such as the Xilinx CP132, 0.5 mm pitch, 14X14 array.

These patent pending ZIF sockets are simply mechanically mounted to the target PCB. The socket lid is twisted open, the IC is inserted, the lid is closed and aluminum heat sink screw is rotated to provide downward force on the IC. The sockets are 5 mm high and only 2.5 mm per side larger than the actual IC packages, minimizing footprint on system boards while maximizing system speeds. The socket body and heat sink screw are constructed with aluminum to facilitate heat-sinking.

Call for pricing information.

Mike Fedde (Marketing & Sales Director)
11351 Rupp Dr.
Suite 400
Burnsville, MN 55337


Tel: 952-229-8200 or (800) 404 – 0204
Fax: 952-229–8201
info@ironwoodelectronics.com
www.ironwoodelectronics.com