Users can socket their Motorola 480TBGA and Cypress BL256 1.27 mm pitch cavity down IC’s

EAGAN, MN. – September, 2003 – Ironwood Electronics’ new high performance solderless SG-BGA-6083 and SG-BGA-6084 allow socketing of Motorola 480TBGA and CypressBL256 BGA packaged IC’s and allow system operate at full speed. The sockets are precision devices, which guides the IC to the exact position for connection of each ball and uses an aluminum compression screw to provide compressive force. The socket is a solderless socket with 6.5 GHz bandwidth interconnects and accommodates the cavity down die of these two packages. The sockets use the same solder, gold, or silver pads to which the BGA can be soldered. The SG-BGA-6083 accepts a 27 mm body IC with 1.27mm pitch with a 20X20X46 array. The SG-BGA-6084 is designed for a 37.5 mm body IC with 1.27mm pitch and a 29X29X5 array. Both sockets are designed for the cavity down Intel packages. The sockets are only slightly larger than the IC requiring only 2.5mm perimeter around the IC. The aluminum socket body provides heatsinking capability up to 5 watts. The sockets have a backing plate, which can be easily modified to accommodate capacitors on the PCB on the opposite of the BGA pattern. These patented ZIF sockets are simply mechanically mounted to the target PCB.

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Tel: 952-229-8200 or (800) 404 – 0204
Fax: 952-229–8201
info@ironwoodelectronics.com
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