EAGAN, MN. – November, 2003 – Ironwood Electronics’ new high performance Sockets – SG-BGA-7022 allow 0.65 mm pitch (Intel FS CSP336) stacked IC’s to be used in socket and operate without compromising performance in very high speed communication applications. The new 10 GHz bandwidth sockets easily support very dense BGA stacked devices utilizing a high performance conductive elastomer contactor. The contact resistance is normally 10 milliohms. The sockets have a precision design, which guides the IC to the exact position for connection of each ball and uses an aluminum heat sink screw to provide compressive force. The socket shown in the picture is SG-BGA-7022 for 14 mm IC body size. The socket accommodates IC packages such as the Intel FS CSP336 BGA, 0.65 mm pitch, and 20X20 arrays. This package, FS CSP336 is used in mobile/handheld applications.

These patented ZIF sockets are simply mechanically mounted to the target PCB. The socket lid is twisted open, the IC is inserted, the lid is closed and aluminum heat sink screw is rotated to provide downward force on the IC. Since the IC is a stacked package (contains top and bottom package), a removable IC frame positioned around the top package distributes forces evenly. This removable IC frame matches the height of the top stacked memory chip configuration. An IC guide precisely aligns the package. The sockets are 7.5 mm high and only 2.5 mm per side larger than the actual IC packages, minimizing footprint on system boards while maximizing system speeds. The SG-BGA-7022 is slightly larger to accommodate filter CAP’s near the BGA pads. The socket body and heat sink screw are constructed with aluminum to facilitate heat-sinking.

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Ila Pal
11351 Rupp Dr.
Suite 400
Burnsville, MN 55337


Tel: 952-229-8200 or (800) 404 – 0204
Fax: 952-229–8201
info@ironwoodelectronics.com
www.ironwoodelectronics.com