Eagan, MN.

Design engineers using 0.8mm BGA/CSP ("MicroBGA") IC devices will be interested in the PB-BGA256K-Z-01 probing adapter from Ironwood Electronics. This two-piece adapter provides easy access to all signals, simplifies IC swap out, and yet consumes only the board real estate needed by the actual IC device. The PB-BGA256K-Z-01 probe board (0.8mm, 17x17 array with ZIF socket) makes all signals available for probing on 0.025" gold plated square posts around the perimeter of the socket. The probe board plugs into Ironwood’s SF-BGA256K-B-01, a low-profile, high density BGA emulation base that solders to a target system using standard flux and reflow techniques. These parts utilize Ironwood’s patent pending interstitial variable height terminal pin system, an innovation that provides pluggable interface capability down to 0.75mm MicroBGA densities.

MicroBGA packages with pitches of 0.8mm and .75mm are becoming increasingly common as chip scale packaging (CSP) techniques reduce overall package size. These IC packages are especially valuable in handheld, portable products, however, MicroBGA devices present several challenges to engineers during product development and testing. Device signals are located underneath the IC device, real estate around the chip is often at a premium and replacing defective devices requires rework procedures that can compromise nearby component connections. Recognizing the difficulties in MicroBGA testing, Ironwood Electronics has developed the innovative technology required and is continually adding to its line of MicroBGA adapters.

Call for pricing information.


Ironwood Electronics, Inc.
11351 Rupp Dr.
Suite 400
Burnsville, MN 55337


Tel: 952-229-8200 or (800) 404 – 0204
Fax: 952-229–8201
info@ironwoodelectronics.com
www.ironwoodelectronics.com