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Ironwood’s high performance line of GHz BGA sockets can be placed on the same PCB real estate as the actual IC and are nearly electrically transparent. Engineers use these sockets to accelerate systems development schedules by eliminating the need for a prototype board to accommodate typical sockets.
EAGAN, MN. - January 16, 2002 – Ironwood Electronics’ latest line of GHz BGA sockets provide the convenience of a ZIF socket for pre-production systems without sacrificing board real estate or device performance. When employing typical mechanical BGA sockets systems, developers often must design a separate prototype board to accommodate the socket’s footprint. Ironwood’s sockets also deliver very high signal integrity, supporting signal bandwidths up to 6GHz in a cost effective package, allowing the socket to be used even in high speed CPU, network, and RF applications without compromising performance.
Ironwood’s patent pending ZIF sockets are available for a wide range of IC body sizes with BGA pitches ranging from 0.75mm to 1.27mm. The sockets are only 2.5 mm per side larger that the actual IC packages, typically less than 12mm high, and mount mechanically to the target PCB. The socket itself is a precision device, guiding the IC to the exact position for connection of each ball to a high performance (1dB signal loss at 6 GHz) conductive elastomer. The socket lid easily twists open and closed for IC insertion and an aluminum heat sink screw provides downward force on the IC.
Call for pricing information.
Mike Fedde
11351 Rupp Dr.
Suite 400
Burnsville, MN 55337
Tel: 952-229-8200 or (800) 404 – 0204
Fax: 952-229–8201
info@ironwoodelectronics.com
www.ironwoodelectronics.com
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