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High Performance Sockets and Adapters |
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Tel: (800) 404-0204 U.S. Only or (952) 229-8200
Fax: (952) 229-8201 email: info@ironwoodelectronics.com
PRESS RELEASE |
Tiny Footprint, High Endurance Socket Compatible with Xilinx FG600, FG676 IC’s
Users can socket 27mm IC’s in minimum space with 500,000 insertion contactor pins.
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Eagan, MN, June 2004- Ironwood Electronics is introducing the SS-BGA676C-01 small footprint socket compatible with IC’s such as the Xilinx FG676. The SS-BGA676C-01 accommodates BGA IC’s with a 27mm body, 26X26 array, and 1.0mm pitch. The contactor is a spring pin (pogo) with 30 gram actuation force per ball and cycle life of 500,000 insertions. The self inductance of the contactor is 0.62 nH with a loss of < 1 dB at 10 GHz. The current capacity of each contactor is 4 amps at ambient temperature. Socket temperature range is -40C to +150C. The socket is mounted to the PCB with a backing plate and requires only 2.54mm border around the IC. The socket is constructed of aluminum which provides heatsinking up to 7.5 watts. Custom heatsinks can easily be designed for higher power dissipation. The user simply places the IC into the socket, closes the lid, and rotates the heatsink screw to seat the IC. The SS-BGA676C-01 is footprint compatible with the Ironwood Electronics SG-BGA-6009 elastomer based socket providing a range of solutions. PCB finish on pads can be HASL, Immersion, Au, Immersion Ag, or tin. The SS-BGA676C-01 is a member of a family of sockets providing small footprint high endurance socketing for 1.0 and 1.27mm pitch BGA IC’s. |