XBT simplifies Burn-in & Test ChallengesXBT socket provides the best solution for Engineering and Burn-in applications due to low cost and better electrical/mechanical performance than conventional solution. XBT sockets are available for 0.4mm to 0.5mm BGA, LGA, QFN, QFP, SOIC and other packages.
Ironwood Electronics XBT sockets are small footprint sockets. The socket needs about 2.5mm extra space around the chip than the actual chip size utilizing only very small PCB real estate. A clamshell lid with a wave spring provides the compression force. This mechanism provides easy chip replacement and compatible with automated handler system also. If heat dissipation is of concern, a heat sink can be integrated in the middle of clamshell lid to dissipate up to 100 watts. XBT socket uses XBT contact technology for high endurance and wide temperature applications. XBT Contact is a machined contact with outside spring that provides a robust solution for Burn-in & Test applications. Solutions are available for 0.4mm to 0.5mm LGA, BGA, QFN, QFP, SOIC and other packages. XBT contact technology has 3 part system which includes top plunger, bottom plunger and a spring. The Brass plungers are machined, plated and assembled to a stainless steel gold plated spring inside a high temperature plastic cavity eliminating the need for an external shell or barrel.
Typical specifications for the XBT contact technology include:
There are three options available to mount these sockets. The socket can be mounted using hardware and needs holes for screws and can be positioned on the target board. If the holes cannot be drilled on the target board, epoxy mount sockets are the other option. Epoxy mount sockets use epoxy and special mechanism to mount the socket on the target board. The third option is using SMT emulator base. The SMT emulator base has balls on the bottom side that precisely matches the device array and has hardware for socket mounting.
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