CBT-AQFN-7000
QFN Socket; Stamped Spring Pin
pitch(mm):
0.50
pin count:
84
IC size X (mm):
7.00
IC size Y (mm):
7.00
IC array X:
21
IC array Y:
21
$ 867.3
Min. Qty.
CBT-BGA-3000
BGA Socket; Stamped Spring Pin
pitch(mm):
0.35
pin count:
195
IC size X (mm):
5.46
IC size Y (mm):
4.72
IC array X:
13
IC array Y:
15
Heat Sink:
no
IC Top Surface:
Flat
socket lid:
Snap
$ 1394.4
Min. Qty.
CBT-BGA-3001
BGA Socket; Stamped Spring Pin
pitch(mm):
0.30
pin count:
256
IC size X (mm):
4.80
IC size Y (mm):
4.80
IC array X:
16
IC array Y:
16
Heat Sink:
no
IC Top Surface:
Flat
socket lid:
Snap
$ 2387.7
Min. Qty.
CBT-BGA-6000
BGA Socket; Stamped Spring Pin
pitch(mm):
1.00
pin count:
676
IC size X (mm):
27.00
IC size Y (mm):
27.00
IC array X:
26
IC array Y:
26
Heat Sink:
no
IC Top Surface:
Mold Cap
socket lid:
Clamshell
$ 1509.9
Min. Qty.
CBT-BGA-6001
BGA Socket; Stamped Spring Pin
pitch(mm):
1.00
pin count:
484
IC size X (mm):
23.00
IC size Y (mm):
23.00
IC array X:
22
IC array Y:
22
Heat Sink:
no
IC Top Surface:
Mold Cap
socket lid:
Clamshell
$ 1516.2
Min. Qty.
CBT-BGA-6002
BGA Socket; Stamped Spring Pin
pitch(mm):
0.80
pin count:
196
IC size X (mm):
12.00
IC size Y (mm):
12.00
IC array X:
14
IC array Y:
14
Heat Sink:
no
IC Top Surface:
Flat
socket lid:
Clamshell
$ 998.55
Min. Qty.
CBT-BGA-6003
BGA Socket; Stamped Spring Pin
pitch(mm):
0.80
pin count:
196
IC size X (mm):
12.00
IC size Y (mm):
12.00
IC array X:
14
IC array Y:
14
Heat Sink:
no
IC Top Surface:
Flat
socket lid:
Clamshell
$ 1119.3
Min. Qty.
CBT-BGA-6004
BGA Socket; Stamped Spring Pin
pitch(mm):
0.80
pin count:
422
IC size X (mm):
19.00
IC size Y (mm):
19.00
IC array X:
22
IC array Y:
22
Heat Sink:
no
IC Top Surface:
Mold Cap
socket lid:
Clamshell
$ 1481.55
Min. Qty.
CBT-BGA-6005
BGA Socket; Stamped Spring Pin
pitch(mm):
0.80
pin count:
684
IC size X (mm):
27.00
IC size Y (mm):
27.00
IC array X:
32
IC array Y:
32
Heat Sink:
no
IC Top Surface:
Flat
socket lid:
Clamshell
$ 1517.25
Min. Qty.
CBT-BGA-6006
BGA Socket; Stamped Spring Pin
pitch(mm):
1.00
pin count:
480
IC size X (mm):
23.00
IC size Y (mm):
23.00
IC array X:
22
IC array Y:
22
Heat Sink:
no
IC Top Surface:
Mold Cap
socket lid:
Clamshell
$ 1186.5
Min. Qty.
CBT-BGA-6007
BGA Socket; Stamped Spring Pin
pitch(mm):
1.00
pin count:
491
IC size X (mm):
27.00
IC size Y (mm):
27.00
IC array X:
26
IC array Y:
26
Heat Sink:
no
IC Top Surface:
Mold Cap
socket lid:
Clamshell
$ 1203.3
Min. Qty.
CBT-BGA-6008
BGA Socket; Stamped Spring Pin
pitch(mm):
1.00
pin count:
352
IC size X (mm):
23.00
IC size Y (mm):
23.00
IC array X:
22
IC array Y:
22
Heat Sink:
no
IC Top Surface:
Mold Cap
socket lid:
Clamshell
$ 1535.1
Min. Qty.
CBT-BGA-6009
BGA Socket; Stamped Spring Pin
pitch(mm):
1.00
pin count:
899
IC size X (mm):
31.00
IC size Y (mm):
31.00
IC array X:
30
IC array Y:
30
Heat Sink:
no
IC Top Surface:
Mold Cap
socket lid:
Clamshell
$ 1962.45
Min. Qty.
CBT-BGA-6010
BGA Socket; Stamped Spring Pin
pitch(mm):
1.00
pin count:
324
IC size X (mm):
19.00
IC size Y (mm):
19.00
IC array X:
18
IC array Y:
18
Heat Sink:
no
IC Top Surface:
Flat
socket lid:
Clamshell
$ 1210.65
Min. Qty.
CBT-BGA-6011
BGA Socket; Stamped Spring Pin
pitch(mm):
1.00
pin count:
48
IC size X (mm):
9.00
IC size Y (mm):
12.00
IC array X:
9
IC array Y:
11
Heat Sink:
no
IC Top Surface:
Flat
socket lid:
Clamshell
$ 838.95
Min. Qty.
CBT-BGA-6012
BGA Socket; Stamped Spring Pin
pitch(mm):
0.80
pin count:
432
IC size X (mm):
19.00
IC size Y (mm):
19.00
IC array X:
23
IC array Y:
23
Heat Sink:
no
IC Top Surface:
Mold Cap
socket lid:
Clamshell
$ 1353.45
Min. Qty.
CBT-BGA-6013
BGA Socket; Stamped Spring Pin
pitch(mm):
0.80
pin count:
523
IC size X (mm):
21.00
IC size Y (mm):
21.00
IC array X:
25
IC array Y:
25
Heat Sink:
no
IC Top Surface:
Mold Cap
socket lid:
Clamshell
$ 1346.1
Min. Qty.
CBT-BGA-6014
BGA Socket; Stamped Spring Pin
pitch(mm):
1.00
pin count:
144
IC size X (mm):
13.00
IC size Y (mm):
13.00
IC array X:
12
IC array Y:
12
Heat Sink:
no
IC Top Surface:
Flat
socket lid:
Clamshell
$ 975.45
Min. Qty.
CBT-BGA-6015
BGA Socket; Stamped Spring Pin
pitch(mm):
1.00
pin count:
2097
IC size X (mm):
52.50
IC size Y (mm):
52.50
IC array X:
51
IC array Y:
51
Heat Sink:
no
IC Top Surface:
Flat
socket lid:
Clamshell
$ 3528
Min. Qty.
CBT-BGA-6016
BGA Socket; Stamped Spring Pin
pitch(mm):
0.80
pin count:
260
IC size X (mm):
15.00
IC size Y (mm):
15.00
IC array X:
18
IC array Y:
18
Heat Sink:
no
IC Top Surface:
Flat
socket lid:
Clamshell
$ 1066.8
Min. Qty.