ONFi

ONFi Memory Package
ONFi Memory Package

Open Nand Flash Interface (ONFi) specify a unique package & I/O configurations. This catalog covers the variations within the ONFi specifications. LGA & leaded devices can be tested using the Copper Pillar technology.

Typical Applications Ball Count – Socket size – Pitch-Product Device Ball Diameter +/- 0.05 mm Option with SAC 305 Solder Balls Option with Eutectic Solder Balls Standard - No Solder Balls
onfi 63 socket 63 – 9.0 x 11.0 – 0.8 – Grypper 0.45 105526-0097 105526-0090 105526-0082
Device Press - 9.0 x 11.0 103864-0048
Stencil MOQ (10) N/R N/R 104553-0083
onfi 100 socket 100 – 12.0 x 18.0 – 1.0 – Grypper 0.45 105526-0089 105526-0088 105526-0057
Device Press – 12.0 x 18.0 103864-0083
Stencil - 100 - 12.0 x 18.0 N/R N/R 104553-0133
onfi 132 socket 132 – 12.0 x 18.0 – 1.0 – Grypper 0.50 104670-0040 104670-0043 104670-0032
Device Press- 12.0 x 18.0 103864-0083
Stencil – 132 – 12.0 x 18.0 N/R N/R 104553-0217
onfi 152 socket 152 – 14.0 x 18.0 – 1.0 – Grypper 0.50 104670-0041 108656-0036 104670-0036
Device Press – 14.0 x 18.0 103864-0116
Stencil – 152 – 14.0 x 18.0 N/R N/R 104553-0248
onfi 272 socket 272 – 14.0 x 18.0 – 0.8 – Grypper/G80 0.55 107206-0052 107206-0016 107206-0013
Device Press – 14.0 x 18.0 103864-0116
Stencil - 272 - 14.0 x 18.0 N/R N/R 104553-0354
onfi 316 socket 316 – 14.0 x 18.0 – 0.8 – Grypper/G80 0.50 107088-0011 107088-0012 107088-0010
Device Press – 14.0 x 18.0 103864-0116
Stencil - 316 - 14.0 x 18.0 104553-0289

 

Actual device measurements should be reviewed to ensure proper fit with socket contacts

Options:      With Solder balls: SAC 305 or Eutectic

Extraction Tool: 105900-0004

Extraction Tool

Extraction Tool: 105900-0004 Extraction Tool

Reference JEDEC and ONFi Specifications; JEDEC - JESD230 and ONFi 3.2 Standards for standard device pin configurations

 

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