QFN / QFP35 Sockets

0.4mm Pitch QFN Socket
0.4mm Pitch QFN Socket

Test sockets are designed for testing today's high-performance QFN, QFP, DFN and SOIC devices. For development, characterization, at speed burn-in, and low volume production manual testing.

  • Signal performance: Miniature stamped contacts provide extremely short signal path
  • Oxide-cutting wipe action: The QFN35 contact wipes the package pad, cutting through solder oxides
  • Near-device decoupling: Small footprints, with large underside frame decoupling pockets designed to standard dimensioned packages, allow for near-device placement of passive components
  • Reduced ground inductance: Multiple compliant ground contacts reduce ground inductance and provide a thermal path through the PCB. A solid ground block can be incorporated for further product enhancements
  • Replaceable contact sets: Test sockets with replaceable contact sets offer a significant cost savings vs. the purchase of a new test socket

 

QFN/QFP socket contact cross section
QFN / QFP35 Contact Height

The table below is the JEDEC MO-220 listing of the "Thermally Enhanced Thin and Very Thin" QFN devices The Ironwood part number listed designates the socket we have designed for the various standard QFN devices by BODY SIZE, LEAD COUNT and PITCH. The design has a press that will accommodate the device thickness in the range of the MIN and MAX listed. If you have a device thickness outside the limits we can accommodate this easily with either a modified press or one from another design. The contacts in the center for the ground pad lists the Minimum size the socket will accommodate. Other ground configuration can be designed and Solid ground blocks also can be designed for maximum thermal dissipation when required. Ironwood also has 100's of additional designs for other variations of QFN, QFP and DFN and SOIC devices. Always submit a package drawing so we can ensure the proper fit. CAD Footprint drawings are available for all the socket part numbers listed for your PCB layout.

Ironwood
QFN35
Socket
Assembly
Part
Number
JEDEC MO-220 QFN Devices
Device Press
(other Presses available
for Device thickness
outside the range listed)
Ground
Contacts
BODY SIZE
(D) x (E)
Lead
Pitch
(e)
Lead
Count
MIN “A”
(Device
Thickness)
MAX “A”
(Device
Thickness)
MIN
Ground
Pad size
(D1) x (E1)
2.00
2.00
0.50
8
3.00
3.00
0.80
4
0.65
8
0.65
12
0.65
14
0.65
1.00
none
0.50
12
0.50
16
0.65
1.00
1.0 x 1.0
0.40
16
0.40
20
0.70
1.05
1.0 x 1.0
3.50
3.50
0.50
20
3.50
4.50
0.50
20
0.75
1.10
1.5 x 2.5
3.00
4.00
0.80
8
0.65
12
0.50
16
0.50
20
0.75
1.10
1.5 x 2.5
4.00
4.00
0.80
12
0.80
14
0.65
12
0.65
16
0.60
0.95
2.0 x 2.0
0.50
14
0.50
16
0.50
20
0.65
1.00
1.5 x 1.5
0.50
24
0.65
1.00
1.5 x 1.5
0.50
28
0.40
28
4.00
5.00
0.80
10
0.80
14
0.80
16
0.65
18
0.50
28
0.50
24
0.40
32
0.65
1.00
2.0 x 3.0
0.40
34
4.50
5.50
0.50
32
4.50
6.50
0.50
36
5.00
5.00
0.80
16
0.75
1.10
3.0 x 3.0
0.80
20
0.65
20
0.75
1.10
3.0 x 3.0
0.65
24
0.75
1.10
1.5 x 1.5
0.50
28
0.65
1.00
1.5 x 1.5
0.50
32
0.65
1.00
1.5 x 1.5
0.40
36
0.40
40
0.65
1.00
3.0 x 3.0
5.00
6.00
0.80
18
0.80
20
0.65
22
5.00
7.00
0.50
32
0.50
38
0.75
1.10
2.5 x 5.0
0.50
40
5.50
6.50
0.50
40
6.00
6.00
0.80
20
0.80
24
0.65
28
0.75
1.10
2.0 x 2.0
0.65
24
0.65
32
0.50
36
0.75
1.10
4.0 x 4.0
0.50
38
0.50
40
0.65
1.00
4.0 x 4.0
0.50
32
0.40
48
0.65
1.00
4.0 x 4.0
7.00
7.00
0.80
28
0.65
32
0.65
36
0.65
32
0.50
40
0.50
44
0.65
1.00
4.0 x 4.0
0.50
48
0.65
1.00
4.0 x 4.0
0.40
56
0.75
1.10
4.0 x 4.0
7.00
9.00
0.50
38
8.00
8.00
0.80
28
0.80
32
0.65
36
0.65
40
0.65
44
0.50
48
0.50
52
0.50
56
0.65
1.00
4.7 x 4.7
0.40
64
0.65
1.00
5.0 x 5.0
0.40
68
0.70
1.05
5.0 x 5.0
9.00
9.00
0.80
36
0.65
1.00
5.2 x 5.2
0.65
48
0.65
44
0.50
56
0.50
60
0.65
1.00
5.2 x 5.2
0.50
64
0.65
1.00
5.0 x 5.0
0.40
72
0.40
76
0.65
1.00
5.0 x 5.0
10.00
10.00
0.50
64
0.65
1.00
5.0 x 5.0
0.50
68
0.65
1.00
none
0.50
72
0.65
1.00
6.2 x 6.2
0.40
84
0.40
88
0.65
1.00
6.0 x 6.0
12.00
12.00
0.50
80
0.50
88
0.65
1.00
6.5 x 6.5
0.40
100
0.70
1.05
6.5 x 6.5
0.40
108

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