Press Releases

Lever Actuated Spring Pin Socket for NXP’s MCU Socket your 501 pin BGA using Extreme Temperature Socket with Superior Electrical Performance

Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for Micro Controller Unit - CBT-BGA-6075. The contactor is a stamped spring pin with 31 gram actuation force per ball and cycle life of 125,000 insertions. The self inductance of the contactor

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75GHz BGA Socket for IDT’s FCCSP121 Quickly and easily Socket your 0.5mm pitch 11x11 array, BGA121 packages on any application board with performance equivalent to direct solder version

Ironwood Electronics has recently introduced a new BGA socket design using high performance elastomer capable of 75GHz, very low inductance and wide temperature applications. The GT-BGA-2082 socket is designed for 6x6 mm package size and operates at bandwidths up to

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Elastomer Socket for High Bandwidth 0.5mm Pitch 64QFP Socket your High Speed QFP IC using elastomer socket with superior electrical performance

Ironwood Electronics has recently introduced a new high performance QFP socket for 0.5mm pitch 64 pin QFP. The SG-QFE-7020 socket is designed for 10mm x 10mm x 1.6mm package size with 12mmx12mm lead tip to tip and operates at bandwidths

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Swivel Lid Spring Pin BGA Socket for LP-DDR4 Socket your 200 pin BGA using Extreme TemperatureSocket with Superior Electrical Performance

Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for testing BGA devices - SBT-BGA-7051. The contactor is a stamped spring pin with 31 gram actuation force per ball and cycle life of 125,000 insertions. The self

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On Semi Device Converter Allows TSOPs to be used in SOIC footprint without re-spinning mother board Fairchild 74LVX3245MTC 0.65mm pitch TSOP can be used on an existing 1.27mm pitch 24 position SOIC SMT lands via cost effective leadless adapter

Ironwood Electronics' new device converter - DC-SO/SO-AKL24323-L-01 allows customers to use 0.65mm pitch TSOP on a 1.27mm pitch SOIC footprint. These device converters can be soldered directly onto the SMT SOIC pads using standard solder methods. The characteristics one should consider when

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