Press Releases

75GHz Socket for NXP’s BGA141 Quickly and easily Socket your 0.65mm pitch 13x13 array, 141BGA packages on any application board with performance equivalent to direct solder version

January 2017

Ironwood Electronics has recently introduced a new BGA socket design using high performance elastomer capable of 75GHz, very low inductance and wide temperature applications. The GT-BGA-2061 socket is designed for 10x10 mm package size and operates at bandwidths up to

Production test Socket for NXP’s FLIP CHIP SIP Socket and Test your 14x10mm BGA device using extreme temperature socket

December 2016

Ironwood Electronics recently introduced a new Stamped spring pin socket addressing high performance requirements for testing BGA208 - CBT-BGA-7041. The contactor is a stamped spring pin with 31 gram actuation force per ball and cycle life of 125,000 insertions. The self inductance of the

Open Top BGA Socket for BGA449 Socket your 449 pin BGA using Extreme Temperature Socket with Superior Electrical Performance

December 2016

Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for testing BGA devices - SBT-BGA-7035. The contactor is a stamped spring pin with 31 gram actuation force per ball and cycle life of 125,000 insertions. The self inductance of the contactor

Swivel Lid Spring Pin BGA Socket for LVDS IC Socket your 77 pin BGA using Extreme Temperature Socket with Superior Electrical Performance

November 2016

Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for testing BGA devices - SBT-BGA-6537. The contactor is a stamped spring pin with 31 gram actuation force per ball and cycle life of 125,000 insertions. The self inductance of the contactor

30 GHz Bandwidth Socket for mixed pitch BGA378 Socket your 378 pin BGA packages on any PCB without significant performance loss and without soldering

November 2016

Ironwood Electronics has recently introduced a new high performance BGA socket for 0.61mmx0.635mm pitch BGA 378 pin IC's. The SG-BGA-7303 socket is designed for 18.2x9.7mm BGA package and operates at bandwidths up to 30 GHz with less than 1dB of

Press Releases

75GHz Socket for NXP’s BGA141 Quickly and easily Socket your 0.65mm pitch 13x13 array, 141BGA packages on any application board with performance equivalent to direct solder version

Production test Socket for NXP’s FLIP CHIP SIP Socket and Test your 14x10mm BGA device using extreme temperature socket

Open Top BGA Socket for BGA449 Socket your 449 pin BGA using Extreme Temperature Socket with Superior Electrical Performance

Swivel Lid Spring Pin BGA Socket for LVDS IC Socket your 77 pin BGA using Extreme Temperature Socket with Superior Electrical Performance

30 GHz Bandwidth Socket for mixed pitch BGA378 Socket your 378 pin BGA packages on any PCB without significant performance loss and without soldering

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