Press Releases

70GHz Elastomer Socket Supporting 28 Watt Power Dissipation Quickly and easily Socket your 37.5x37.5mm, 0.65mm pitch BGA packages on any application board with performance equivalent to direct solder version. Socket has heatsink + fan with swivel lid which incorporates a quick insertion method so that IC’s can be changed out quickly.

September 2026

Read more >>

Spring Pin Socket for QFN20 With Double Latch Lid Socket and test 3x3mm QFN with 0.4mm pitch using low inductance spring pin contact that has 10GHz bandwidth, cycle life of 250,000 insertions, and operates at -55C to +180C.

August 2026

Read more >>

Spring Pin Socket for BGA500 With Double Latch Lid Socket and test 23x23mm BGA with 0.5mm pitch using low inductance spring pin contact that has 36GHz bandwidth, cycle life of 250,000 insertions, and operates at -55C to +150C.

June 2026

Read more >>

Burn-in Socket for Power Modules Dual cavity burn-in socket with multiple spring pins per device pad to accommodate current draw. It also features gold plated copper compression heatsink for removing heat. These sockets are mounted on a daughter card which gets plugged into mother board for burn-in test.

May 2026

Read more >>

86GHz Elastomer Socket for QFN3 Device High performance and low inductance gold plated embedded wire in elastomer as interconnect material between device and PCB operates 86GHz at -1dB insertion loss, 0.06nH self-inductance, with 2A current capacity. Simple swivel lid socket structure enables industry’s smallest footprint.

March 2026

Read more >>

Pricing Show Form

"*" indicates required fields

Your Country*

Your Email*