Press Releases

Spring Pin Socket for BGA500 With Double Latch Lid Socket and test 23x23mm BGA with 0.5mm pitch using low inductance spring pin contact that has 36GHz bandwidth, cycle life of 250,000 insertions, and operates at -55C to +150C.

June 2026

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Burn-in Socket for Power Modules Dual cavity burn-in socket with multiple spring pins per device pad to accommodate current draw. It also features gold plated copper compression heatsink for removing heat. These sockets are mounted on a daughter card which gets plugged into mother board for burn-in test.

May 2026

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86GHz Elastomer Socket for QFN3 Device High performance and low inductance gold plated embedded wire in elastomer as interconnect material between device and PCB operates 86GHz at -1dB insertion loss, 0.06nH self-inductance, with 2A current capacity. Simple swivel lid socket structure enables industry’s smallest footprint.

March 2026

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Spring pin socket for DFN2 Designed for up to 500,000 actuation cycles, the socket is able to handle -1db@60GHz performance over a temperature range of -40C to +150C.

February 2026

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Chip Size 0.8mm Pitch BGA Socket Adapter 19x19mm body, 22X22 array 484 ball BGA package to be SMT attached to top adapter or placed inside compression mount socket mounted to top adapter. Bottom adapter attached to target PCB using reflow. Top and bottom adapters can be plugged/un-plugged multiple times and operated without compromising performance in rugged automotive applications.

January 2026

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