On Semi Device Converter Allows TSOPs to be used in SOIC footprint without re-spinning mother board Fairchild 74LVX3245MTC 0.65mm pitch TSOP can be used on an existing 1.27mm pitch 24 position SOIC SMT lands via cost effective leadless adapter

Ironwood Electronics’ new device converter – DC-SO/SO-AKL24323-L-01 allows customers to use 0.65mm pitch TSOP on a 1.27mm pitch SOIC footprint. These device converters can be soldered directly onto the SMT SOIC pads using standard solder methods. The characteristics one should consider when selecting a SOIC lead-less emulator device converter are as follows: a) surface mountable – both hand soldering as well as reflow process compatible b) durable c) reduced stress on target board d) true leadless SOIC design and e) compact design.

The Ironwood Electronics device converter DC-SO/SO-AKL24323-L-01 consists of footprint and pin out conversion PCB with a SOIC24 leadless interface for SMT processing. This high performance adapter has the same pad configuration as the SOIC device. The leadless pads are constructed with precise geometry to accomplish the accurate SOIC package emulation. DC-SO/SO-AKL24323-L-01 is designed to receive Fairchild 74LVX3245MTC device on the top and converts pin mapping to 24 SOIC footprint that has 1.27mm pitch on the bottom. This device converter allows a low-cost method of replacing legacy devices without re-spinning the mother board.

A complete list of surface mount adapters can be seen in the following link.


Pricing for the DC-SO/SO-AKL24323-L-01 is $55 each at qty 1 which includes Fairchild 74LVX3245MTC device assembled on to PCB with SOIC leadless emulator.