Press Releases

Clamshell Production Test Socket for ASE’s FC BGA1164 Socket and Test your 25x25mm BGA device using extreme temperature socket

May 2017

Ironwood Electronics recently introduced a new Stamped spring pin socket addressing high performance requirements for testing BGA1164 - CBT-BGA-7042. The contactor is a stamped spring pin with 31 gram actuation force per ball and cycle life of 125,000 insertions. The

40 GHz Bandwidth Socket for QFN40 Package Socket your Quad Flat No Lead package using elastomer socket with superior electrical performance

April 2017

Ironwood Electronics has recently introduced a new high performance elastomer socket for 0.4mm pitch QFN package. The CG25-QFN-2003 socket is designed for a 5mmx5mm package size and operates at bandwidths up to 40 GHz with less than 1dB of insertion

Removable Lid Spring Pin Socket for LGA module Socket your LGA48 using Extreme Temperature Socket with Superior Electrical Performance

April 2017

Ironwood Electronics recently introduced a new LGA socket addressing high performance requirements for custom pitch devices - CBT-LGA-5015. The contactor is a stamped spring pin with 14.5 gram actuation force per pin and cycle life of 100,000 insertions. The self inductance of the contactor

Package Converter Technology converts QFN Device to BGA Footprint QFN package can be installed in boards made for BGA devices, saving the cost and time of respinning the PCB

March 2017

Ironwood Electronics' new adapter for the 16 pin BGA device allow use of the equivalent IC in QFN package to be used in PCB boards developed for BGA packages. The PC-QFN16A/BGA16C-01 is mapped specifically for the On Semiconductor multi-function differential

Stamped Spring Pin Socket for 3mm pitch SOIC Module Socket your SOIC24 using Extreme Temperature Socket with Superior Electrical Performance

March 2017

Ironwood Electronics recently introduced a new socket addressing high performance requirements for Burn-in and Test applications - SBT-SOIC-2000. The contactor is a stamped spring pin with 31 gram actuation force per ball and cycle life of 125,000 insertions. The self

Press Releases

Clamshell Production Test Socket for ASE’s FC BGA1164 Socket and Test your 25x25mm BGA device using extreme temperature socket

40 GHz Bandwidth Socket for QFN40 Package Socket your Quad Flat No Lead package using elastomer socket with superior electrical performance

Removable Lid Spring Pin Socket for LGA module Socket your LGA48 using Extreme Temperature Socket with Superior Electrical Performance

Package Converter Technology converts QFN Device to BGA Footprint QFN package can be installed in boards made for BGA devices, saving the cost and time of respinning the PCB

Stamped Spring Pin Socket for 3mm pitch SOIC Module Socket your SOIC24 using Extreme Temperature Socket with Superior Electrical Performance

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