Press Releases

30 GHz Bandwidth Socket for BGA1086 Package Socket your BGA package using elastomer socket with superior electrical performance

June 2016

Ironwood Electronics has recently introduced a new high performance elastomer socket for 0.65mm pitch BGA package. The SG-BGA-9002 socket is designed for a 25mmx25mm package size and operates at bandwidths up to 30 GHz with less than 1dB of insertion

Stamped Spring Pin Universal BGA Socket for Memory Devices Socket your 96, 78, 64 pin BGA using Extreme Temperature Socket with Superior Electrical Performance

May 2016

Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for memory devices - CBT-BGA-6048. The contactor is a stamped spring pin with 31 gram actuation force per ball and cycle life of 125,000 insertions. The self inductance of the contactor is

30 GHz Bandwidth Socket for 0.5mm Pitch eMMC Packages Socket your 153 pin BGA packages on any PCB without significant performance loss and with no soldering and no mounting hardware or screws

May 2016

Ironwood Electronics has recently introduced a new high performance BGA socket for 0.5mm pitch BGA 153 pin IC's. The SG-BGA-7292 socket is designed for a eMMC memory package and operates at bandwidths up to 30 GHz with less than 1dB

Production test Socket for eMMC Socket and Test your 11.5x13mm BGA device using extreme temperature socket

April 2016

Ironwood Electronics recently introduced a new Stamped spring pin socket addressing high performance requirements for testing BGA153 - CBT-BGA-7037. The contactor is a stamped spring pin with 31 gram actuation force per ball and cycle life of 500,000 insertions. The self inductance of the

Package Converter Technology allows use of SMT devices on through hole PCB SOIC package can be installed in boards made for DIP devices, saving the cost and time of respinning the PCB

April 2016

Ironwood Electronics' new adapter for the 14 pin DIP device allow use of the equivalent IC in SOIC package to be used in PCB boards developed for DIP packages. The PC-SOIC/DIP14-06 is mapped specifically for the Texas Instruments Linear Comparator

Press Releases

30 GHz Bandwidth Socket for BGA1086 Package Socket your BGA package using elastomer socket with superior electrical performance

Stamped Spring Pin Universal BGA Socket for Memory Devices Socket your 96, 78, 64 pin BGA using Extreme Temperature Socket with Superior Electrical Performance

30 GHz Bandwidth Socket for 0.5mm Pitch eMMC Packages Socket your 153 pin BGA packages on any PCB without significant performance loss and with no soldering and no mounting hardware or screws

Production test Socket for eMMC Socket and Test your 11.5x13mm BGA device using extreme temperature socket

Package Converter Technology allows use of SMT devices on through hole PCB SOIC package can be installed in boards made for DIP devices, saving the cost and time of respinning the PCB

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