Clamshell Spring Pin Socket for Intel FBGA Socket your 780 pin BGA using Extreme Temperature Socket with Superior Electrical Performance
Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for FineLine Ball grid Array – CBT-BGA-6111. The contactor is a stamped spring pin with 19 gram actuation force per ball and cycle life of 125,000 insertions. The self inductance of the contactor is 0.93 nH, insertion loss < 1 dB at 4.15 GHz and contact resistance is <30mOhms. The current capacity of each contactor is 4 amps at 80C temperature rise. Socket temperature range is -55C to +180C. Socket also features a floating guide for precise ball to pin alignment. The specific configuration of the package to be tested in the CBT-BGA-6111 is a BGA, 29x29mm, 1mm pitch, 780 position, 28×28 ball array. The socket is mounted using supplied hardware on the target PCB with no soldering, and uses smallest footprint for nearby passive components. Socket uses stiffener plate to support back side of the PCB and allows passive components to be placed via customized pockets. This socket utilizes clamshell lid with integrated compression mechanism. The socket is constructed with aluminum for heat dissipation and can be customized with fan and heat sink for high power dissipation. To use, place the device inside the socket, close the clamshell lid by latching and apply downward pressure by turning the compression screw. This socket can be used for hand test and temperature cycling as well as debugging application in development and device characterization.
Pricing for the CBT-BGA-6111 is $1419 at qty 1 with reduced pricing available depending on quantity required.