Stamped Spring Pin BGA Socket for NXP MCUs Socket your 292 pin BGA using Extreme Temperature Socket with Superior Electrical Performance

Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for Micro Controller Units – CBT-BGA-6062. The contactor is a stamped spring pin with 31 gram actuation force per ball and cycle life of 125,000 insertions. The self inductance of the contactor is 0.88 nH, insertion loss < 1 dB at 15.7 GHz and contact resistance is <30mOhms. The current capacity of each contactor is 4 amps at 60C temperature rise. Socket temperature range is -55C to +180C. Socket also features a floating guide for precise ball to pin alignment. The specific configuration of the package to be tested in the CBT-BGA-6062 is a BGA, 17x17mm, 0.8mm pitch, 292 position, 20×20 ball array. The socket is mounted using supplied hardware on the target PCB with no soldering, and uses smallest footprint for nearby passive components. Socket uses 5 post stiffener plate to support back side of the PCB and allows passive components to be placed in between posts. This socket utilizes clamshell lid with integrated compression mechanism. To use, place the BGA device into the socket base and close the clamshell lid assembly on to the base using the latch. Turning the compression screw handle applies downward pressure via integrated compression plate. This socket can be used for hand test and temperature characterization as well as debugging application in development and MCU comparison between various manufacturers.

Pricing for the CBT-BGA-6062 is $927 at qty 1 with reduced pricing available depending on quantity required.