Press Releases

Chip Size 0.8mm Pitch BGA Socket Adapter 19x19mm body, 22X22 array 484 ball BGA package to be SMT attached to top adapter or placed inside compression mount socket mounted to top adapter. Bottom adapter attached to target PCB using reflow. Top and bottom adapters can be plugged/un-plugged multiple times and operated without compromising performance in rugged automotive applications.

January 2026

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Test Socket for QFN24 with Double Latch Manual Actuator Socket and test 4x4mm QFN with 0.5mm pitch using stamped spring pin contact that has 14g force per pad, cycle life of 125,000 insertions, and operates at -55C to +180C.

December 2025

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Near Zero Footprint SMT Elastomer Socket for BGA264 Ironwood Electronics introduces near device size footprint test socket incorporating high performance GT elastomer. Specific package to be tested is a BGA with mixed pitch 0.6x0.675mm and 8.7x14.4mm device size. GT elastomer with SMT board provides bandwidth up to 43GHz.

November 2025

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94GHz Elastomer Socket for BGA1440 Test a 75 watt BGA device with high performance elastomer using a simple swivel lid mechanism. Elastomer connects each signal with -1dB insertion loss at 94GHz frequency to PCB. Heatsink with fan keeps BGA device junction temperature not exceeding 100C.

October 2025

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94GHz Socket for BGA400 with 12 Watt Power Dissipation Test and debug 17x17mm IC, 0.8mm pitch with high performance elastomer socket with 94GHz bandwidth while operating at -55C to +160C. Heatsink compression screw can dissipate 12 watt power at room temperature.

September 2025

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