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Clamshell Spring Pin BGA Socket for ASE’s 36 Balls FCCSP Socket your 36 pin BGA using Extreme Temperature Socket with Superior Electrical Performance

March 2014

Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for testing BGA devices - CBT-BGA-7501. The contactor is a stamped spring pin with 14.3 gram actuation force per ball and cycle life of 125,000 insertions. The self

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Chip Size 0.5mm Pitch BGA Socket Adapter for Toshiba’s e-MMC Users can socket their 153 pin 0.5mm pitch THGBM5G6A2JBAIR 8GB IC's with socket whose footprint same as IC footprint

February 2014

Ironwood Electronics' new high performance socket - SFS-BGA153B-52 allows 0.5mm pitch, 11.5x13mm body, 14X14 array e-MMC module product housed in 153 ball BGA package to be placed in socket and operated without compromising performance in memory applications. The Giga-snaP™ BGA

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Swivel Lid Spring Pin BGA Socket for Geometric Processors Socket your 223 pin BGA using Extreme Temperature Socket with Superior Electrical Performance

February 2014

Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for testing BGA devices - SBT-BGA-7019. The contactor is a stamped spring pin with 31 gram actuation force per ball and cycle life of 125,000 insertions. The self

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10 GHz Bandwidth Socket for 8mm QFN Package Socket your 8mm Quad Flat No Lead package using elastomer socket with superior electrical performance

January 2014

Ironwood Electronics has recently introduced a new high performance elastomer socket for 0.5mm pitch QFN package. The SG-MLF-7079 socket is designed for an 8mmx8mmx0.8mm package size and operates at bandwidths up to 10 GHz with less than 1dB of insertion

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