Press Releases

Chip Size 0.5mm Pitch BGA Socket Adapter for Toshiba’s e-MMC Users can socket their 153 pin 0.5mm pitch THGBM5G6A2JBAIR 8GB IC's with socket whose footprint same as IC footprint

February 2014

Ironwood Electronics' new high performance socket - SFS-BGA153B-52 allows 0.5mm pitch, 11.5x13mm body, 14X14 array e-MMC module product housed in 153 ball BGA package to be placed in socket and operated without compromising performance in memory applications. The Giga-snaP™ BGA

Swivel Lid Spring Pin BGA Socket for Geometric Processors Socket your 223 pin BGA using Extreme Temperature Socket with Superior Electrical Performance

February 2014

Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for testing BGA devices - SBT-BGA-7019. The contactor is a stamped spring pin with 31 gram actuation force per ball and cycle life of 125,000 insertions. The self

10 GHz Bandwidth Socket for 8mm QFN Package Socket your 8mm Quad Flat No Lead package using elastomer socket with superior electrical performance

January 2014

Ironwood Electronics has recently introduced a new high performance elastomer socket for 0.5mm pitch QFN package. The SG-MLF-7079 socket is designed for an 8mmx8mmx0.8mm package size and operates at bandwidths up to 10 GHz with less than 1dB of insertion

Press Releases

Chip Size 0.5mm Pitch BGA Socket Adapter for Toshiba’s e-MMC Users can socket their 153 pin 0.5mm pitch THGBM5G6A2JBAIR 8GB IC's with socket whose footprint same as IC footprint

Swivel Lid Spring Pin BGA Socket for Geometric Processors Socket your 223 pin BGA using Extreme Temperature Socket with Superior Electrical Performance

10 GHz Bandwidth Socket for 8mm QFN Package Socket your 8mm Quad Flat No Lead package using elastomer socket with superior electrical performance

Login Form