75 GHz Bandwidth Heat Sink Lid Socket for BGA715 Quickly and easily Socket your 27x27mm, 0.8mm pitch BGA packages on any application board with performance equivalent to direct solder version
Ironwood Electronics has recently introduced a new BGA socket design using high performance elastomer capable of 75 GHz, very low inductance and wide temperature applications. The GT-BGA-6008 socket is designed for 27×27 mm package size and operates at bandwidths up to 75 GHz with less than 1dB of insertion loss. The socket is designed to dissipate 4.5 watts using compression screw with heat sink fins and can be customized up to 100 watts with modified fin design on top of the screw and adding axial flow fan. The contact resistance is typically 20 milliohms per pin. The socket is mounted on the target PCB with no soldering, and uses very small real estate allowing capacitors/resistors to be placed close by. The socket is constructed with swivel lid which incorporates a quick insertion method so that IC’s can be changed out quickly. The socket has center opening for thermocouple and thermal streaming. Compression plate has channels for thermal stream out.
The GT-BGA-6008 socket is constructed with high performance and low inductance elastomer contactor. The temperature range is -55 C to +160 C. Works with IC’s such as BGA, 27x27mm with 32×32 array and 0.8mm pitch.
Pricing for the GT-BGA-6008 is $852 at qty 1; with reduced pricing available depending on quantity required.