The new Giga-snaP™ line of BGA SMD adapters provide the most reliable interconnect to BGA SMT pads. These patent pending adapters remain attached through many solder cycles and will not warp as plastic molded parts. They also offer half the insertion force of other SMT adapters.
Ironwood has developed the industry's widest range of interconnection adaptors for SMT device emulation and interconnect. Our new Giga-snaP™ BGA SMT Package Emulators provide highest speed, reliability, and lowest insertion force. We offer SMT bases and thru-hole adapters for BGA, PLCC, QFP, and SOIC packages.
We offer many adapters for converting IC packaging and device pin outs, solving many IC availability and performance issues. We also offer fix adapters to solve layout problems and some known chip deficiencies. Custom, quick turn solutions are our specialty.
We offer probing adapters and logic analyzer adapters for all SMT package types, as well as socket probes for DIP and PLCC. We are Agilent and Tektronix partners. In addition, we offer adapters to facilitate the use of in-circuit emulators and FPGA development systems.
Ironwood has developed over one thousand prototyping adapter designs, supporting QFN, CSP, BGA, QFP, SOIC, PGA, PLCC, QIP, and DIP packages for most popular prototyping panels. We also offer adapters for PGA DUT interfaces.
Our gold plated interconnects form unique receptacles for BGA, MGA, PGA, QIP, and QFP packages. We also offer parts that provide interconnects for in-circuit emulators.
Ironwood has 25+ years of experience in solving chip obsolescence problem. We can provide complete turn-key solutions for subsystems and IC upgrades that involves design service, component procurement service, component manufacturing, final assembly, X-ray/AOI service, functional/parametric testing and customized packaging.