Grypper G80 / G80 LIF

  • Package-size PCB footprint: Since the PCB footprint of G80 is identical to the package, only one PCB design is required, enabling a seamless transition from test and validation through production and reducing overall cost of test
  • Low insertion force: Unique contact design reduces the insertion force required to insert and retain higher-ball-count packages safely and securely within the test socket
  • No lid required: The package snaps directly without a lid, enabling easy probing, scoping and troubleshooting the topside of the device
  • Excellent signal performance: A short signal path achieves low inductance and low insertion loss, providing a nearly invisible electrical connection


Key Applications

BGA Probes for Logic Analyzers and Oscilloscopes


Vendors & Partners


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