Technical Articles

IC Chip Obsolescence Solutions: Package Converters How to Select RF Test Socket Heat Sinking Through Socket Contact Technologies Sockets and Adapters FAQ: How to order IC Sockets Impact of PCB Plating Finish on Elastomer Socket Technology Challenges of on-board narrow-pitch connections for microwave components Achieving a 75GHz Test Socket A 20GHz pluggable 0.5mm pitch BGA connector simplifies test/verification IC Socket- Carrier for Semiconductor Devices in Finished Product Functional Testing of 0.3mm Pitch WLP IC Socket Footprint- Why is it important? DOE relates spring probe variables to signal integrity Package Converter Compliments Chip Obsolescence 3D IC Development Needs Innovative Socket Solution Enhanced interconnect medium simplifies test & verification Role of Sockets in IC Product Life Cycle IC Interconnects for the Life of Your Product S-Parameter Simulation for Sockets & Adapters Chip size IC Socket Solution for BGA and CSP Methodical Socket Selection Speeds up Time-to-Market for IC Development Projects Optimizing Insertion Extraction Force in a Pin-Socket Interconnect BGA Socket Considerations - Prototype to Reality BGA Socket with Heatsink for High Power Devices Product Life-Cycle White Paper GHz Bandwidth Socket White Paper ISO White Paper