eMMC

eMMC Memory Package
eMMC Memory Package

These sockets are specifically designed for standard 153 & 169 Ball eMMC devices. Custom probing sockets also available.

 
 
Ball Count-Socket Size-Pitch Device Solder Ball Diameter +/-0.05mm Standard with SAC 305 Solder Balls Option with Eutectic Solder Balls Option with No Solder Balls
emmc 153 socket 153 – 11.5 x 13.0 – 0.5 0.30 107250-0026 108387-0026 107248-0026
Alignment Frame 108639-0003
Device Press – 11.5 x 13.0 103864-0128
Stencil – 153 – 11.5 x 13.0 N/R N/R 104553-0220
153 – with build in Alignment Feature – alignment frame not required – use press and stencil from above
emmc 153 socket 153 – 11.5 x 13.0 – 0.5 0.30 107250-0065 108387-0064 108519-0064
emmc 169 socket 169 – 12.0 x 16.0 – 0.5 0.30 107250-0009 108387-0009 107248-0009
Alignment Frame 106083-0021
Device Press – 12.0 x 16.0 103864-0080
Stencil - 169 – 12.0 x 16.0 N/R N/R 104553-0166
169 – 14.0 x 18.0 – 0.5 0.30 107250-0012 108387-0066 107248-0012
Alignment Frame 106083-0028
Device Press – 14.0 x 18.0 103864-0116
Stencil – 169 -14.0 x 18.0 N/R N/R 104553-0175

 

Actual device measurements should be reviewed to ensure proper fit with socket contacts

Other configurations / socket outline sizes available upon request

Alignment Frames are now ordered separately and recommended to ensure device alignment before inserting into the socket

 

153 – Smaller Outline Sockets
Ball Count-Socket Size- Pitch Device Solder
Ball Diameter
+/-0.05mm
Standard with SAC 305 Solder Balls Option with Eutectic Solder Balls Option with No Solder Balls
emmc 153 smaller outline socket 153 – 11.5 x 10.0 – 0.5 0.30 107250-0050 108387-0067 107248-0050
Alignment Frame 108639-0010
Device Press – 11.5 x 10.0 103864-0095
Stencil – 153 – 11.5 x 10.0 N/R N/R 104553-0287
153 – 10.0 x 11.0 – 0.5 0.30 107250-0045 108387-0068 107248-0045
Alignment Frame 108639-0004
Device Press – 10.0 x 10.0 103864-0054
Stencil – 153 – 10.0 x 10.0 N/R N/R 104553-0275
153 – 10.5 x 10.5 – 0.5 0.30 107250-0052 108387-0069 107248-0052
Alignment Frame 108639-0011
Device Press – 10.5 x 10.5 103864-0073
Stencil – 153 – 10.5 x 10.5 N/R N/R 104553-0292
153 - 11.5 x 8.0 - 0.5 0.30 108348-0004 108387-0070 107610-0004
Alignment Frame 108639-0001
Device Press - 11.4 x 8.0 103864-0108
Stencil - 153 - 11.5 x 8.0 N/R N/R 104553-0236
153 - 10.0 x 10.0 - 0.5 0.30 107250-0059 108387-0059 107248-0059
Alignment Frame 108639-0029
Device Press - 10.0 x 10.0 103864-0033
Stencil - 153 - 10.0 x 10.0 N/R N/R 104553-0318
153 - 7.5 x 11.5 - 0.5 0.30 109069-0002 109069-0001 109069-0003
Alignment Frame n/a
Device Press - 7.5 x 10.3 103864-0119
Stencil - 153 - 7.5 x 11.5 N/R N/R 104553-0418
153 - 7.5 x 7.5 - 0.5 0.30 109106-0002 109106-0001 109106-0003
Alignment Frame n/a
Device Press - 7.0 x 7.0 103864-0077
Stencil - 153 - 7.5 x 7.5 N/R N/R 104553-0496

 

N/R - Not Required for sockets with solder balls attached

Other configurations / socket outline sizes available upon request

Extraction Tool: 105900-0004

Custom designs for probing - inquire

Extraction Tool

Custom designs for probing - inquire Extraction Tool

Combination Grypper with Spring Pin snap on ring for probing LGA pad on eMMC devices

Spring Pin snap on ring for probing LGA pad on eMMC devices
emmc memory package

 

Request For Quote or call us at 1-800-404-0204.